In the world of electronics, heat management is crucial. Polymer composites, especially those with boron nitride (BN), are widely used for this purpose. However, their effectiveness depends on how well the fillers are arranged and how they interact with the surrounding material. This study dives into these aspects using advanced computer simulations.

Nonequilibrium molecular dynamics (NEMD) showed that modifying BN with hydroxyl groups doesn't change its thermal conductivity much, but it significantly reduces thermal resistance. Finite element simulation (FEM) then revealed that keeping BN at a specific angle can boost both vertical and horizontal heat flow in the composite.

In the lab, scientists created BN-modified hydroxyethyl cellulose (HEC) composites using a clever "moisture-activated" strategy. This method not only reduces thermal resistance but also helps the fillers align properly. The results? These composites can conduct heat extremely well, with in-plane thermal conductivity reaching 30. 64 W/mK and cross-plane conductivity at 5. 06 W/mK. They also adapt well to different surfaces, lowering thermal resistance to 1. 42 K·cm²/W.

But the real test came when these composites were put to practical use. They helped reduce the temperature of an LED Al substrate by an impressive 15. 05 °C compared to standard composites.

Water-Boosted Boron Nitride: A Game Changer in Heat Conduction

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