TSMC is making waves in the tech world with its SoIC (system on integrated chips) advanced packaging. This isn't just any packaging. It's a game-changer, offering lower power use and other perks. Two big names are pushing this tech forward: Apple and AMD. These companies are placing big orders, driving TSMC's growth in this area.

    SoIC packaging is different from SoC (system on a chip). It allows for two advanced chips to be stacked directly on top of each other. This setup enables ultra-dense connections between the chips. The result? Reduced latency, boosted performance, and better efficiency. It's like giving your computer a serious upgrade.

    Apple is expected to use this packaging in its upcoming M5 series. This series will likely power the updated 14-inch and 16-inch MacBook Pro models. However, the base model might miss out on this tech. The M5 Pro and possibly more powerful variants are the ones that will benefit from SoIC packaging.

    TSMC is shifting its focus from CoWoS (Chip on Wafer on Substrate) to SoIC. This move is driven by the demand from Apple, AMD, and potentially NVIDIA. The company is ramping up production of SoIC packaging, aiming to have it ready by the end of 2025. This could be the start of a new trend in the tech industry.

    During TSMC's 2024 Symposium, the company expressed optimism about SoIC adoption. They believe that around 30 designs will be released between 2026 and 2027. This tech could revolutionize how we think about chip design and performance. It's an exciting time for tech enthusiasts and industry watchers alike.

Apple and AMD Fueling TSMC's SoIC Packaging Boom

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